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The difference between UV encapsulants and heatset encapsulants for electronic paper

The difference between UV encapsulants and heatset encapsulants for electronic paper

  • Categories:Industry News
  • Author:
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  • Time of issue:2023-05-25
  • Views:559

(Summary description)UV encapsulant is a UV light-curing adhesive, mainly consisting of oligomers, UV photoinitiators, i.e. photosensitizers, active releasers and some other additives. Under the irradiation of UV light, the photoinitiator produces a free radical reaction, which causes the colloidal substance to cross-link and eventually change from a liquid to a solid.

The difference between UV encapsulants and heatset encapsulants for electronic paper

(Summary description)UV encapsulant is a UV light-curing adhesive, mainly consisting of oligomers, UV photoinitiators, i.e. photosensitizers, active releasers and some other additives. Under the irradiation of UV light, the photoinitiator produces a free radical reaction, which causes the colloidal substance to cross-link and eventually change from a liquid to a solid.

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2023-05-25
  • Views:559
Information

UV encapsulant is a UV light-curing adhesive, mainly consisting of oligomers, UV photoinitiators, i.e. photosensitizers, active releasers and some other additives. Under the irradiation of UV light, the photoinitiator produces a free radical reaction, which causes the colloidal substance to cross-link and eventually change from a liquid to a solid.

Heat curing is a kind of glue which is cross-linked under high temperature, mainly consisting of epoxy resin and some other additives. Under heating conditions, the cross-linking agent in the glue will react and form chamber and covalent bonds, making the glue harden and have high strength. Therefore, the chemical composition of UV encapsulants and heat-curing encapsulants is different.

Differences in curing methods and applications:

UV encapsulants and heat cured encapsulants also differ significantly in the way they are cured. UV encapsulants require UV light to initiate a cross-linking reaction and therefore cure very quickly and do not require special curing conditions such as heating. Heat cured adhesives, on the other hand, require a high temperature reaction and a longer curing time.

Therefore, in practice, UV encapsulants can achieve rapid bonding and are suitable for applications that require rapid curing, such as electronic products, automotive manufacturing and other fields, while heat-curing encapsulants are suitable for applications that require high temperature environments, such as aerospace, military and other fields.

UV encapsulants and heat-curing encapsulants also have major differences in application areas. UV encapsulants are widely used in electronics, communications, optoelectronics, medical and household applications due to their fast curing and high bonding strength. The heat-curing encapsulants are suitable for applications that require higher temperature and corrosion resistance and high strength requirements.

Vigon Technology has developed a new UV encapsulant, which is different from the conventional thermosetting encapsulants, with the characteristics of fast curing, no baking, energy saving and cost reduction, etc. It effectively avoids all the defects of the following conventional encapsulants.

1. conventional electronic paper encapsulants need to be stored at ultra-low temperature -40℃ throughout the process, because the conventional encapsulant temperature will rise and affect the performance of use. Ordinary coolers do not meet the -40°C requirement, so special low temperature coolers and dry ice are required for storage and transport. At the same time, it needs to be operated at room temperature as soon as possible, otherwise the encapsulant will warm up and cure and become unusable. 2.

2. The use of electronic paper encapsulants requires heat to cure. Curing requires 65-80 degrees low temperature baking for a longer period of time, this process is less efficient although it will increase the heating link equipment and reduce production assembly efficiency.

Product features:

1、Fast surface drying, low curing temperature    

2、Good levelling, simple process

3、Excellent sealing and water barrier

4、The adhesive layer is flexible and can be adapted to a variety of temperature environments

5、No solvent, low stimulation, no pollution to air

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