UV encapsulants and heat-curing encapsulants are two different types of adhesive, especially in terms of chemical composition, curing methods and areas of application. This article will describe the differences between UV encapsulants and heat curing encapsulants.

1. Chemical composition

UV encapsulant is a UV-curable adhesive, which is mainly composed of oligomer, UV initiator, i.e. photosensitizer, active release agent and some other additives. The photoinitiator, when irradiated by UV light, produces a free radical reaction, which causes the gel-like substance to cross-link and finally change from a liquid to a solid state.

A thermosetting encapsulant is a glue that undergoes a cross-linking reaction under high temperature conditions. It consists mainly of an epoxy resin and some additives. Under heating conditions, the cross-linking agents in the glue react to form room and covalent bonds, resulting in a high strength curing of the glue.

2. Curing methods

UV encapsulant and heat-curing encapsulant curing methods also have obvious differences. UV encapsulant through the role of ultraviolet light to make the photoinitiator free radical reaction, which triggers a cross-linking reaction, to achieve rapid curing effect, without heating and other special curing conditions. Heat curing adhesives need to be cured under high temperature conditions and the curing time is relatively long.

3. Application areas

 UV encapsulants and thermosetting encapsulants also have significant differences in their application areas. Due to the fast curing and high bond strength of UV encapsulants, they are widely used in electronics, communications, optoelectronics, medical and household applications. The invention is suitable for applications requiring high temperature resistance, corrosion resistance and high strength, such as aerospace, military and other fields

In summary: UV sealants have obvious advantages compared to thermosetting sealants. Microcrystalline Technology's latest development of a UV encapsulant is a new product that is different from conventional thermosetting encapsulants. It has the characteristics of fast curing, no baking, energy saving and cost reduction, and effectively avoids the following defects of conventional thermosetting encapsulants:

1. Conventional thermosetting encapsulants need to be kept at an ultra-low temperature of -40°C throughout the process, and ordinary freezers cannot meet the -40°C requirement, so special low-temperature freezers are required. During transport, dry ice insulation is also required for transport. When used at room temperature it needs to be operated as soon as possible, otherwise the thermosetting sealant will react and the viscosity will increase significantly and not work properly, with a short construction window

2. The use of thermosetting sealants requires heating for curing. Curing requires long baking times at temperatures of 65-80 degrees. This characteristic leads to a longer process and longer process time, which results in lower output efficiency, increased manufacturing costs, and increased energy consumption.

A graphene modified high toughness UV-LED curing frame sealer developed by Vigon Materials Technology. The product has fast curing, long dispensing process window, excellent water and gas barrier characteristics, good toughness of the adhesive layer, high adhesion to glass, metal, PET and other materials, and can be used for chip, electronic paper and other electronic components packaging.