WJ-UV1103A is a low energy UVcuring protective adhesive developed
by Vigon Technology for the electronics industry.
This product is designed to protect COF(chip-on-film) in LCD modules due to its fast surface drying,
low moisture permeability, cleaning resistance, ease ofrework, and excellent stability and reliability.
It is an insulating and protective material for package circuit boards and FPD electrodes.

WJ-UV1101A is a low modulus high water resistance one-component metal protection adhesive developed by VigonTechnology. The product can achieve low energy fast curing, high glue stability,
good moisture resistance and strong adaptability
Suitable for a variety of coating applications with stringent humidity reliability
requirements such as metal and ITO/COG coatings in OLED/LCD module components.

WJ-EP1321A is a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product can achieve rapid curing, glue stability is very high, dispensing process window period is long: has excellent water vapour barrier properties of the adhesive layer toughness.Excellent adhesion to glass, metal, PET and PS can be used for packaging of electronic paper, chips and other electronic components.

WJ-EP1320A is a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product offers fast curing, a long dispensing process window and excellent vapour barrier properties.Excellent adhesion to glass, metal, PET and PS, etc. It can be used for the encapsulation of electronic paper, chips and other electronic components.

WJ-EP1319Vis a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product allows for fast curing at 55°C and a long process window for the dispensing process.Excellent water vapour barrier properties, good toughness of the adhesive layer, excellent adhesion to glass, metal, PET and PS and other materials, can be used for electronic paper, chips and other electronic components encapsulation.

WJ-UV1002A is a graphene-modified high tenacity UV-heat curing dual-curing adhesive developed by Vigon Technology.The product is fast drying, easy to apply, has a long process window and excellent water vapour barrier properties after curing.Good toughness of the adhesive layer, high adhesion to glass, metal, PET and PS etc. It can be used for encapsulation of electronic paper, chips and other electronic components.

WJ-UV1001A is a graphene modified high tenacity UV curing adhesive developed by Vigon Technology.The product is fast curing, easy to apply, has a long process window and excellent water vapour barrier properties after curing.Good toughness of the adhesive layer, high adhesion to glass, metal, PET and PS etc. It can be used for encapsulation of electronic paper, chips and other electronic components.

WJ-EP1319M is a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product allows for fast curing at 70°C and a long process window for the dispensing process.toughness of the adhesive layer, excellent adhesion to glass, metal, PET and PS and other materials, can be used for electronic paper, chips and other electronic components encapsulation.

Copper substrate graphene (WJCS/F) is a graphene film with single-layer, double-layer and few-layer (3-5layers, 6-8layers, 10/20/30layers) prepared by chemical vapor deposition process with high quality copper foil as the substrate to grow graphene on the surface of copper foil.

Single-side grown copper substrate graphene (WJCOS/F) is a product that uses a special production process to grow graphene on only one side of the copper foil, and we can provide single-layer graphene film,double-layer graphene film and few-layer graphene film.

"Soak—and-take" Graphene (WJCDS/F) is made of a protective film spin-coated on the substrate graphene and then transferred to deionized water, where the etchant is rinsed and ready for use.

Self-transferring nickel foam graphene (WJSN) is a three-dimensional graphene product that retains the spatial structure of nickel foam.Customers can release it in deionized water and then transfer it to the target substrate to form a foam-like graphene structure.Product size can be customized upon request

Silicon oxide wafer substrate Graphene is prepared by transferring graphene to the surface of any type of silicon  oxide wafer.Single-layer graphene films, double-layer graphene films and few-layer graphene films are available.Film size can be customized upon request.

Silicon substrate graphene is prepared by transferring graphene to the surface of any type of silicon wafer.Provide single-layer graphene films, double-layer graphene films and few-layer graphene films.Film size can be customized upon request.

Trivial Transfer Graphene (WJSSA/F) is obtained by etching away the copper substrate, which is based on CVD Graphene on Copper, Pretreated with PMMA.The graphene/protective layer film is then transferred to the prepared "overhanging substrate".Receiving the product,customer can simply release it gently in deionized water to obtain.The Graphene that can be directly transferred to any substrate.