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15805691910

sale@hfweijing.com

Building C3, Science and Technology Industrial Park, No. 168 Xiangzhang Avenue, Hefei City

产品名称

MCL adhesive

WJ-UV1102A is a low modulus high water resistanceone-component metal protection adhesive developed by Vigon Technology.The product can realize low-energy fast curing, high adhesive stability, good moisture resistance and
strong adaptability is suitable for a variety of needs to have strict humidity reliability requirements of the coatingapplication, such as OLED / LCD module components in the metal, ITO / COG coating, etc.
产品名称

Edge Sealing Adhesive

产品名称

Tuffy adhesive

WJ-UV1103A is a low energy UVcuring protective adhesive developed
by Vigon Technology for the electronics industry.
This product is designed to protect COF(chip-on-film) in LCD modules due to its fast surface drying,
low moisture permeability, cleaning resistance, ease ofrework, and excellent stability and reliability.
It is an insulating and protective material for package circuit boards and FPD electrodes.
产品名称

MCL adhesive

WJ-UV1101A is a low modulus high water resistance one-component metal protection adhesive developed by VigonTechnology. The product can achieve low energy fast curing, high glue stability,
good moisture resistance and strong adaptability
Suitable for a variety of coating applications with stringent humidity reliability
requirements such as metal and ITO/COG coatings in OLED/LCD module components.
产品名称

Viscosity stable type Edge sealing adhesive

WJ-EP1321A is a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product can achieve rapid curing, glue stability is very high, dispensing process window period is long: has excellent water vapour barrier properties of the adhesive layer toughness.Excellent adhesion to glass, metal, PET and PS can be used for packaging of electronic paper, chips and other electronic components.
产品名称

Repairable edge sealing adhesive

WJ-EP1320A is a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product offers fast curing, a long dispensing process window and excellent vapour barrier properties.Excellent adhesion to glass, metal, PET and PS, etc. It can be used for the encapsulation of electronic paper, chips and other electronic components.
产品名称

Low temperature curing edge sealing adhesive

WJ-EP1319Vis a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product allows for fast curing at 55°C and a long process window for the dispensing process.Excellent water vapour barrier properties, good toughness of the adhesive layer, excellent adhesion to glass, metal, PET and PS and other materials, can be used for electronic paper, chips and other electronic components encapsulation.
产品名称

UV curing edge sealing adhesive

WJ-UV1002A is a graphene-modified high tenacity UV-heat curing dual-curing adhesive developed by Vigon Technology.The product is fast drying, easy to apply, has a long process window and excellent water vapour barrier properties after curing.Good toughness of the adhesive layer, high adhesion to glass, metal, PET and PS etc. It can be used for encapsulation of electronic paper, chips and other electronic components.
产品名称

UV curing edge sealing adhesive

WJ-UV1001A is a graphene modified high tenacity UV curing adhesive developed by Vigon Technology.The product is fast curing, easy to apply, has a long process window and excellent water vapour barrier properties after curing.Good toughness of the adhesive layer, high adhesion to glass, metal, PET and PS etc. It can be used for encapsulation of electronic paper, chips and other electronic components.
产品名称

Special edge sealing adhesive for electronic paper

WJ-EP1319M is a graphene modified high tenacity one-component epoxy edge sealer developed by Vigon Technology.The product allows for fast curing at 70°C and a long process window for the dispensing process.toughness of the adhesive layer, excellent adhesion to glass, metal, PET and PS and other materials, can be used for electronic paper, chips and other electronic components encapsulation.
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Contact Us

E-mail:sale@hfweijing.com
Website:http://www.hfweijing.com/

Add:Building C3, Science and Technology Industrial Park, No. 168 Xiangzhang Avenue, Hefei City

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