Electronic paper, also known as digital paper. It is an ultra-thin and ultra-light display, understood as "a paper thin, soft, and rewritable display". Visually speaking, electronic paper is a thin film, and the charged substance 'coated' on the film is electronic ink. This can also be seen as a thin built-in remote control display board.

Potting adhesive is a type of adhesive that can be used for sealing, bonding, potting, and coating protection of electronic components. Before curing, the adhesive is liquid and has fluidity. The viscosity of adhesive varies depending on the material, performance, and production process of the product. Its value can only be realized after complete cure. After solidification, it can play a waterproof, moisture-proof, confidential, corrosion-resistant, temperature resistant, dustproof, insulation, thermal conductivity, and shockproof role. At present, there are many types of electronic potting adhesives on the market. In terms of material types, there are currently three commonly used types, namely silicone sealant, polyurethane sealant, and epoxy resin sealant. The choice of glue filling will directly affect the accuracy and timeliness of electronic products. How to choose a suitable sealing adhesive for enterprise products among numerous types of sealing adhesives has become a technical challenge. So, what are the types and advantages and disadvantages of common sealing adhesives.

1. Silicone potting adhesive

Advantages: The silicone potting material is soft after curing, and has two forms: solid rubber and silicone gel, which can eliminate most of the mechanical stress and play the role of shock absorption protection. It has stable physical and chemical properties, good resistance to high and low temperatures, and can work for a long time in the range of -50~200 ° C. Excellent weather resistance, able to provide good protection outdoors for more than 20 years, and not prone to yellowing. Has excellent electrical performance and insulation ability. After sealing, it can effectively improve the insulation between internal components and circuits, and improve the stability of electronic components. With excellent repair ability, sealing components can be quickly and conveniently removed for maintenance and replacement.

Disadvantages: Poor bonding performance, poor water resistance, and low hardness of the material itself, not suitable for encapsulating shell parts

2. Polyurethane potting adhesive

Polyurethane potting adhesive, also known as PU potting adhesive, is generally a two component system consisting of a main agent and a curing agent. Polyurethane adhesive has good adhesion performance, insulation performance, and weather resistance. Mainly used in various electronic packages that require encapsulation. On electrical equipment. The characteristics of polyurethane sealing materials are adjustable hardness, moderate strength, good elasticity, water resistance, mold resistance, impact resistance, transparency, excellent electrical insulation and flame retardancy, no corrosion to electrical components, and good adhesion to metals such as steel, aluminum, copper, tin, and rubber plastic materials. Sealing materials can protect electronic components and circuits installed and debugged from vibration, corrosion, moisture, and dust.

Polyurethane sealing materials are different from epoxy resin sealing adhesives and organic silicone resin sealing adhesives in the electronics industry. They overcome the drawbacks of commonly used epoxy resins such as brittleness, yellowing, and high internal stress, as well as the drawbacks of low strength, poor adhesion, and poor water resistance of organic silicone resins. They have excellent water resistance, cold resistance, UV resistance, acid and alkali resistance, high and low temperature impact resistance, moisture resistance, environmental protection, and high cost-effectiveness, It is an ideal sealing and protection material for electronic components. Polyurethane sealant, fully meeting the requirements of flame retardant V0 level certification (Unilever), ecological environment protection certification (SGS), etc., is a sealant developed by the electronics industry for long-term protection of precision circuit controllers and components. It has excellent electrical insulation and is particularly suitable for sealing electronic circuit boards and components used in harsh environments such as damp, vibration, and corrosive environments. Suitable for sealing various electronic components, microcomputer control boards, etc., such as pulse igniters, washing machine control boards, electric bicycle drive controllers, etc.

Disadvantage: Low high temperature resistance and easy foaming, so vacuum degassing must be used

3. Epoxy resin potting adhesive

Advantages: Most epoxy resin sealing adhesives are relatively hard. The biggest advantage of this material is that it has good adhesion and insulation to the material, and the cured product has good water resistance and acid and alkali resistance. The temperature resistance of epoxy resin is generally 100 ° C. This material can be used as a transparent material with good transparency.

Disadvantages: The ability to resist cold and heat changes is weak, and cracks are easily generated after being impacted by cold and heat, resulting in water vapor seeping into electronic components from the cracks, and poor moisture-proof ability. After solidification, the colloid has high hardness, brittleness, and mechanical stress, which can easily damage electronic components. After the epoxy resin is sealed and cured, due to its high hardness, it cannot be opened. Therefore, this product is a "lifetime" product and components cannot be replaced. Transparent epoxy resin materials generally have poor weather resistance and are prone to yellowing under light or high temperature conditions.

A high toughness single component epoxy potting adhesive developed by Hefei Vigon. This product has good flowability and excellent adhesive layer toughness; Excellent adhesion to materials such as glass, PET, and metal; It can be used for encapsulation of chips, electronic paper, and other electronic components, with good usage effects. This product has the characteristics of low viscosity, easy leveling, simple process, long operation time, flexible adhesive layer, excellent adhesion, suitable for various substrates, green environmental protection, solvent-free, etc. At the same time, Hefei Microcrystalline can also provide customized electronic sealant application solutions, which have a wide range of applications and can be applied in various industry fields.