The future of the electronic paper industry is very good and many people are bullish. The boom in the electronic paper industry has increased considerably and many companies have laid out related businesses. This is also due to the rapid rise of the electronic ruler industry in the context of global carbon neutrality. The size of the global e-paper market has reached phenomenal proportions and the future of the e-paper industry is set to be highly desirable, especially in a digital and sustainable state.

One-component potting and two-component adhesives are the preferred adhesives for electronic components, electronic paper and chip encapsulation and are more commonly found in the market. A single component potting adhesive is a medium or high temperature curing potting adhesive compounded with a latent epoxy curing agent. It often requires heating to cure and usually requires low temperature storage. Compared to two-component potting adhesives, one-component potting adhesives require no mixing during use, are simple to handle and are free of air bubbles during use. In addition, the curing time of single component sealants can be controlled, and after curing, they meet increasingly stringent requirements in terms of sealability, water resistance, bond strength and electrical performance. One-component potting adhesives are superior to two-component potting adhesives in terms of temperature resistance and adhesion, and are commonly used in applications such as integrated circuit encapsulation, electronic paper sealing, smart card core box encapsulation, sensitive component encapsulation and automated roll-to-roll processing of modules.

Performance advantages of one-component potting adhesives:

1. Good impact resistance: this adhesive is elastic and can effectively absorb external shocks. Good protection of electronic components fragile things, reduce the occurrence of accidents.

2. Stable chemical properties: This is a major advantage of the one-component potting adhesive, which can resist the erosion of chemicals and does not corrode other things.

3. Excellent electrical characteristics: in the work, it will play the role of insulation and moisture-proof, so that it can play a better effect. Make the most of these performances and seek to better protect the object of application.

4. Heat and cold resistance: there are no strict temperature requirements for this adhesive, which can be used between minus 50 and 250 degrees Celsius. Even in the range of minus 40 degrees to minus 200 degrees, it works properly, consistently and reliably.

5. Good weather resistance: this adhesive is well resistant to UV, mould, moisture and salt spray after curing. All these factors that are not conducive to the normal work of the protected object are isolated, so you can use it with confidence. Work with competent brand suppliers, such as Cosmole, which specialises in one-component potting adhesive research, to provide customised one-component potting adhesive application solutions. Widely used, it can be applied in new energy, military, medical, aviation, shipbuilding, electronics, automotive, instrumentation, power supply, high speed rail and other industries.

Hefei Vigon has developed a high toughness one-component potting adhesive. The product has good flowability, good toughness of the adhesive layer; excellent adhesion to glass, PET, metal and other materials; can be used for chip, electronic paper sealing and other electronic components potting, has a very good effect. The product has the characteristics of low viscosity, easy leveling, simple process, long operation time, flexible adhesive layer, excellent adhesion, suitable for a variety of substrates, green, solvent-free, etc. At the same time, Hefei Microcrystalline can also provide customized electronic sealant application solutions, which can be used in a wide range of industries and fields.