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One-component epoxy potting adhesives for the encapsulation of electronic components

One-component epoxy potting adhesives for the encapsulation of electronic components

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2022-11-20
  • Views:845

(Summary description)A high toughness one-component epoxy frame sealer developed by Hefei Vigon Materials Technology. The product has good flowability and good toughness of the adhesive layer; it has excellent adhesion to glass, PET, metal and other materials; it can be used for chip, electronic paper and other electronic components potting, with good use effect.

One-component epoxy potting adhesives for the encapsulation of electronic components

(Summary description)A high toughness one-component epoxy frame sealer developed by Hefei Vigon Materials Technology. The product has good flowability and good toughness of the adhesive layer; it has excellent adhesion to glass, PET, metal and other materials; it can be used for chip, electronic paper and other electronic components potting, with good use effect.

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2022-11-20
  • Views:845
Information

Epoxy potting adhesive is divided into one-component epoxy potting and two-component epoxy potting. One-component epoxy potting is the application of latent epoxy curing agent with a medium or high temperature curing potting glue, its curing conditions often require heating to cure, usually requiring low temperature storage. Compared to two-component potting adhesives, one-component encapsulants do not need to be mixed and are simple to operate, while there are no bubbles during use. In addition, the curing time of one-component epoxy encapsulants can be controlled, and after curing, they meet increasingly demanding requirements in terms of sealing, waterproofing, bond strength and electrical performance. One-component potting adhesives are better than two-component potting adhesives in terms of temperature resistance and bonding, and are commonly used in integrated circuit packaging, smart card core packaging, sensitive component packaging and module automation roll-to-roll processing.

One-component epoxy potting characteristics

1、Low viscosity, easy to level, simple process, long operation time

2、Flexible adhesive layer, excellent adhesion, suitable for a variety of substrates

3、Excellent waterproof and moisture-proof performance, protect the normal work of components.

4、Fast curing speed, good operability, can improve production efficiency.

5、Excellent performance of shock resistance, can resist external vibration and impact, protect the components from harm.

6、Excellent chemical performance, no corrosive itself, and will not be easily corroded by other substances.

7, excellent weather resistance, can resist ultraviolet light, ozone, mould and salt spray, to protect the components from damage.

A high toughness one-component epoxy frame sealer developed by Hefei Vigon Materials Technology. The product has good flowability and good toughness of the adhesive layer; it has excellent adhesion to glass, PET, metal and other materials; it can be used for chip, electronic paper and other electronic components potting, with good use effect.

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