Epoxy encapsulation glue can be used for electronic components, metal materials, bonding and sealing, currently on the market to two-component encapsulation glue, and two-component glue needs to be weighed and mixed before use, the mixing process may also exist in the mixing ratio, mixing uniformity deviation, after mixing there are a lot of bubbles and many other problems, not easy to operate, not suitable for mechanised production, reducing production efficiency and capacity, and the actual mass production There is also the situation that the product is not used in time and wasted, which increases the production costs.

A high tenacity one component epoxy frame sealer developed by Vigon Technology. The product is easy to use without mixing and does not produce air bubbles during use. The one-component epoxy sealer has good fluidity and toughness; it has excellent adhesion to glass, PET, metal and other materials; it can be used for chip, electronic paper and other electronic components potting.

Product features.

1, no need to mix, no risk of poor curing when the amount of glue is small, easy to fine micro-dispensing.

2, itself has excellent shear strength, especially for metal, glass, PET, etc. for difficult to stick surface more effective. 

3, low viscosity, easy to level, simple process, long operation time

4、The adhesive layer is flexible, excellent adhesion, suitable for a variety of substrates

5、Green and environmental protection, solvent-free