Electronic paper, also known as digital paper. It is an ultra-thin, ultra-light display, which is understood as a "paper-thin, soft, erasable display". Metaphorically speaking, electronic paper is a thin film on which a layer of electrically charged material is "coated" with electronic ink. It can also be thought of as a thin, embedded remote display board.

With the continuous advancement of electronic paper display technology, it has many features such as ultra-low power consumption, paper-like feel, sunlight visibility, zero power consumption, eye protection without blue light, thinness and ultra-wide viewing angle. Along with the development of the Internet of Things, e-paper is being used in a wide range of scenarios and fields, from centimetre to metre size levels.
E-paper technology is a "micro-encapsulated electrophoretic display" technology. The basic principle is that charged nanoparticles suspended in a liquid are subjected to an electric field that causes them to migrate. E-ink is made up of millions of microcapsules. Each microcapsule contains electrophoretic particles - negatively charged white and positively charged black particles - suspended in a transparent liquid. Using the principle of positive and negative attraction, when an electric field is applied, the black or white particles corresponding to that block move to the top of the microcapsules and the user can see the white or black on that block.

E-paper edge sealant is an adhesive used to encapsulate electronic paper screens and is mainly made of environmentally friendly solvent-free polyurethane or epoxy resin material. Its main features are strong adhesion, rapid hardening, high temperature resistance, freezing resistance and good weather resistance etc. When used, after placing and fixing the e-paper screen on the sealing glue and waiting for the glue to dry and harden, it can effectively prevent the e-paper screen from being oxidised, worn or damaged. In addition, Microcrystalline's e-paper edge sealant also has low temperature and fast curing characteristics, which is an improvement over conventional products, lowering the curing temperature, accelerating the curing speed and improving the efficiency of use.

Conventional e-paper edge sealants have many of the above advantages, but also have some shortcomings that are difficult to overcome:

1. Ultra-low temperature storage is required throughout the process. Conventional electronic paper edge sealant generally requires ultra-low temperature storage -40 ℃, the temperature increases will be cured to affect the use of performance. Generally, the common cooler can only reach -18 low temperature, far from the requirements of -40 ℃, which requires the use of special low-temperature storage cooler, transport process to use dry ice to maintain ultra-low temperature; and the operation is generally in room temperature conditions, need to be used in a short period of time, otherwise the edge sealant will curing can not be used. This greatly increases the difficulty and cost of use.

2、Heating is required for curing. Conventional electronic paper edge sealing adhesive use is not immediately cured bonding, but need 65-80 degrees low temperature baking 50-70 minutes, before curing molding. This process will lead to electronic paper assembly line to increase the heating link equipment, reduce the production of assembly efficiency, increased production costs.

The new generation of UV light curing electronic paper edge sealant is to avoid the above problems, without the need for ultra-low temperature storage throughout, but also without heating can be quickly cured; only need to be stored in a refrigerated box (5-10 ℃) to maintain full performance, curing only need UV light curing equipment irradiation can be 15 seconds. This greatly reduces the difficulty of use and saves costs. It is a high toughness graphene modified UV-LED curing adhesive developed by Microcrystalline Technology. The product is fast curing, easy to work with, has a long process window and has excellent water vapour barrier properties after curing. The adhesive layer has good toughness and high adhesion to glass, metal, PET and other materials, and can be used for the encapsulation of chips, electronic paper and other electronic components.