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VIGON Technology at IOTE 2023 20th International Internet of Things Exhibition-Shenzhen
- Categories:Company News
- Author:
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- Time of issue:2023-09-23
- Views:971
(Summary description)On 20th September, IOTE 2023 20th International Internet of Things Exhibition was grandly opened in Shenzhen International Convention and Exhibition Centre. This year's exhibition gathered nearly 1,000 exhibitors from all over the world, presenting advanced products and solutions from domestic and foreign companies in the fields of e-paper, RFID, sensors, communications, data and cloud platforms. At the same time, it also provides a platform for exhibitors and visitors to interact, exchange and co-operate. As one of the exhibitors in this exhibition, Hefei VIGON Materials Technology Co., Ltd. actively and enthusiastically participated in this event, and displayed our latest scientific research achievements and innovative products in the field of e-paper sealing adhesive for the majority of internal and external partners in the industry, which aroused widespread attention and interest.
VIGON Technology at IOTE 2023 20th International Internet of Things Exhibition-Shenzhen
(Summary description)On 20th September, IOTE 2023 20th International Internet of Things Exhibition was grandly opened in Shenzhen International Convention and Exhibition Centre. This year's exhibition gathered nearly 1,000 exhibitors from all over the world, presenting advanced products and solutions from domestic and foreign companies in the fields of e-paper, RFID, sensors, communications, data and cloud platforms. At the same time, it also provides a platform for exhibitors and visitors to interact, exchange and co-operate. As one of the exhibitors in this exhibition, Hefei VIGON Materials Technology Co., Ltd. actively and enthusiastically participated in this event, and displayed our latest scientific research achievements and innovative products in the field of e-paper sealing adhesive for the majority of internal and external partners in the industry, which aroused widespread attention and interest.
- Categories:Company News
- Author:
- Origin:
- Time of issue:2023-09-23
- Views:971
On 20th September, IOTE 2023 20th International Internet of Things Exhibition was grandly opened in Shenzhen International Convention and Exhibition Centre. This year's exhibition gathered nearly 1,000 exhibitors from all over the world, presenting advanced products and solutions from domestic and foreign companies in the fields of e-paper, RFID, sensors, communications, data and cloud platforms. At the same time, it also provides a platform for exhibitors and visitors to interact, exchange and co-operate. As one of the exhibitors in this exhibition, Hefei VIGON Materials Technology Co., Ltd. actively and enthusiastically participated in this event, and displayed our latest scientific research achievements and innovative products in the field of e-paper sealing adhesive for the majority of internal and external partners in the industry, which aroused widespread attention and interest.
VIGON technology in the electronic paper industry, the main direction of electronic paper edge sealing adhesive, for the development of edge sealing adhesive to do a comprehensive technical layout, for different applications and production conditions for in-depth analysis and optimisation.
Currently, the optimisation directions in the field of e-paper edge banding adhesive are as follows:
1、Ultra high barrier property
Using the unique barrier property of graphene, the water vapour transmission rate of electronic paper edge sealant can be as low as 2.8 g-mil/100in²-24h, which is better than the industry level.
2、Low temperature curing
WJ-EP1319V is the earlier product in the industry to achieve 1 hour curing at 55℃, which can effectively solve the problem of warping during the process of large-size electronic paper.
3、UV Curing
The company developed UV high barrier system and double curing system products, can achieve rapid curing, to meet the requirements of efficient production, to fill the gap in the UV curing system of electronic paper edge sealing adhesive.
4、Easy rework
80 ℃ disassembly rework can be achieved, significantly reducing the product scrap rate, reduce the overall cost.
5、Efficient construction
Can solve the problem of similar products in the use of viscosity factors affecting the construction efficiency, colloid stability up to 24 hours or more, to achieve efficient continuous automated production.
6、High safety
The nature of the gel layer is stable, solvent-free, non-stimulating to the skin, friendly to the environment.
The exhibits on display are only some of VIGON Technology's products in the field of e-paper edge banding adhesive applications. With further breakthroughs in technology and expansion of application scenarios, it will bring more innovations and possibilities to the e-paper field. We will also actively promote product innovation and development through the application of its technology, contributing advanced scientific research results and solutions to more industries.
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