Potting glue, we are not unfamiliar, potting is the liquid polyurethane compound mechanically or manually into the device with electronic components, circuits, at room temperature or heating conditions cured into excellent performance of thermosetting polymer insulation material. The main function of potting glue, also called electronic glue, is to bond, seal, potting, coating, etc.. Thus, it plays the role of moisture-proof, dust-proof, corrosion-proof and shock-proof for electronic and electrical components, and improves the use of performance and stability parameters, and it is liquid before vulcanisation, which is convenient for filling and easy to use.

Nowadays, most of the electronic paper and electronic products are sealed with silicone sealant, polyurethane sealant and epoxy sealant. Because these three types of adhesive can be made for different products and choose. The adhesion is very good, in the sealing of waterproof aspects is also very good. So, what are the differences between these three types of potting adhesives, let's learn together.

I. Silicone potting adhesives

The long-term protection of sensitive circuits and electronic components is undoubtedly becoming increasingly important in today's sophisticated and demanding electronic applications, and two-component silicone potting materials are undoubtedly one of the best options. With their stable dielectric insulation, silicone potting materials are an effective safeguard against environmental contamination, while at the same time providing stress relief from shocks and vibrations over a wide temperature and humidity range.

II. Polyurethane potting adhesives

Polyurethane elastomeric potting compound overcomes the disadvantages of brittle epoxy resins and low strength and poor adhesion of silicone resins, and has excellent water resistance, cold resistance, UV resistance, acid and alkali resistance, heat resistance, high and low temperature impact resistance, moisture resistance, environmental protection and high cost performance.

III.Epoxy resin potting adhesive

Epoxy potting adhesive has good fluidity, easy to penetrate into the product gap; can be cured at room temperature or medium temperature, moderate curing speed; no bubbles after curing, smooth surface, glossy, high hardness; good acid and alkali resistance, moisture, water, oil and dust resistance, good resistance to humidity, heat and atmospheric aging; has good insulation, pressure resistance, adhesive strength and other electrical and physical properties.

A high toughness one-component potting adhesive developed by Microcrystalline Technology. The product has good flowability and good toughness; excellent adhesion to glass, PET, metal and other materials; can be used for chip, electronic paper sealing and other electronic components potting, with very good use effect. The product has the characteristics of low viscosity, easy leveling, simple process, long operation time, flexible adhesive layer, excellent adhesion, suitable for a variety of substrates, green, solvent-free, etc. At the same time, Hefei Microcrystalline can also provide customized electronic sealant application solutions, which can be used in a wide range of industries and fields.