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Air bubbles in electronic sealants during operation
- Categories:Industry News
- Author:
- Origin:
- Time of issue:2023-02-07
- Views:986
(Summary description)Electronic potting adhesive is liquid before curing, with fluidity, after curing can play a waterproof moisture-proof, dust-proof, insulation, thermal conductivity, confidentiality, anti-corrosion, temperature resistance, shockproof role.In the daily use of operation, I believe that many customers who use electronic potting adhesive have encountered the phenomenon of bubbles when using electronic potting adhesive.
Air bubbles in electronic sealants during operation
(Summary description)Electronic potting adhesive is liquid before curing, with fluidity, after curing can play a waterproof moisture-proof, dust-proof, insulation, thermal conductivity, confidentiality, anti-corrosion, temperature resistance, shockproof role.In the daily use of operation, I believe that many customers who use electronic potting adhesive have encountered the phenomenon of bubbles when using electronic potting adhesive.
- Categories:Industry News
- Author:
- Origin:
- Time of issue:2023-02-07
- Views:986
Electronic potting adhesive is liquid before curing, with fluidity, after curing can play a waterproof moisture-proof, dust-proof, insulation, thermal conductivity, confidentiality, anti-corrosion, temperature resistance, shockproof role.In the daily use of operation, I believe that many customers who use electronic potting adhesive have encountered the phenomenon of bubbles when using electronic potting adhesive.This will result in a lot of small pits and unevenness after curing, which in turn affects the effect of the electronic potting glue, making many users of electronic potting glue very puzzling.So, what is the reason for the electronic potting glue bubbles? Today we will give you a specific analysis of electronic potting glue bubbles how to do? What are the methods to eliminate bubbles?
Causes of air bubbles:
Reason 1: Air bubbles are brought into the glue mixing process or the glue filling process: it is easy to bring air into the glue during the glue mixing process in the wrong way, and if the electronic potting glue is viscous, the air bubbles will be difficult to eliminate. Improper filling process is also very easy to bring air into the glue.
Cause 2: bubbles in the curing process: too fast curing speed, high exothermic temperature, glue curing shrinkage rate, electronic potting glue in the solvent, plasticizer additive too much are easy to produce bubbles in the curing process.
Cause 3: The reaction between the moisture and the curing agent produced gas. The defoamer was not added sufficiently.
Methods for eliminating air bubbles:
1、Use low viscosity electronic potting adhesive, because low viscosity silica gel is easier to discharge bubbles.
2, with professional electronic potting machine potting. Professional electronic potting machine both mixed glue filling, and vacuum potting device, convenient and fast, suitable for large-scale production, need to have a certain strength of the enterprise.
3、Heat the glue at 25-30℃ before dispensing, then mix the electronic potting glue according to the proportion. Mix the glue in clockwise direction with even speed, not fast and slow. The speed should also be uniform when filling the glue, otherwise it is also very easy to produce bubbles.
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