E-paper materials usually need to be cut into various shapes, but when the e-paper module is left for too long, the adhesion of the hot-melt adhesive in the hot-melt layer decreases, resulting in the separation of the hot-melt layer near the ear holes from the substrate and affecting the display. Here we have an overview of the e-paper module manufacturing method.

1、Electronic paper module technology

Eliminates hot melt expansion by eliminating air bubbles between the hot melt adhesive layer and the substrate within the e-paper module.

2、Electronic paper module by the following technology

The e-paper module includes a substrate, an e-paper layer, a PS protective film, and the e-paper layer includes sequentially set OCA layer, PET layer, ITO layer, e-ink layer and hot melt adhesive layer; an adhesive groove passes through the e-ink layer and the hot melt adhesive layer; a sealing adhesive is set on the edge of the e-paper layer, on the edge of the ear and in the adhesive groove to encapsulate the visible area of the e-paper;

3、The production of electronic paper module

Preparation of e-paper material, including PET protective film, e-paper layer and aluminium film, the OCA layer of the e-paper layer is located on one side of the PET protective film and the hot melt adhesive layer of the e-paper layer is located on one side of the aluminium film; the e-paper material is then processed by laser cutting technology so that the e-paper layer is formed on the ear, the ear hole and the adhesive slot. The e-paper layer is adhered to the PS protective film and the substrate and the IC chip is bonded to the substrate. The edges of the e-paper layer, the ears and the space inside the glue slot are filled with sealing glue. After the electrical test has been passed, the e-paper module is made by placing silicone dots on the IC chip position for cleaning.

Cutting the glue groove from the aluminium film side between the ear hole and the electronic paper raw material towards the control laser machine, stopping the cutting of the aluminium film, the hot melt adhesive layer and the electronic ink layer after the cutting. Silver paste is dotted at the ear hole and then the PET protective film of the e-paper raw material is vacuumed by the upper duplicator, 18.S23. said substrate is vacuumed by the lower duplicator to remove the PET protective film from said e-paper raw material, allowing the OCA layer to leak. The PS protective film is then attached to the OCA layer by the upper replicator, and the dotted electronic paper semi-finished module is put into the defoamer to eliminate the air bubbles in the sealing adhesive and solidify. Electrical testing is carried out on the semi-finished electronic paper modules with good edge sealing. Place silicone dots on the IC chips of the semi-finished e-paper module that has passed the test.

Compared with the prior art, the creative design of the glue slot between the ear holes and the electronic paper layer can eliminate the air bubbles between the hot melt adhesive layer and the substrate as well as between the hot melt adhesive layer and the electronic ink layer; in addition, the sealing glue enters the glue slot from the edge of the electronic paper and fills it, so that the space between the sealing edge of the electronic paper, the ear holes and the glue slot is connected and the visible area of the electronic paper is surrounded by the sealing glue; as the sealing glue is subject to The visible area of the electronic paper is surrounded by the edge sealer; as the edge sealer is less affected by thermal expansion and contraction.