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Graphene thermal radiation heat dissipation coating

Graphene thermal radiation heat dissipation coating

  • Categories:Industry News
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  • Time of issue:2022-06-13
  • Views:812

(Summary description)Graphene is a new material in which carbon atoms are tightly packed by sp2 hybrid connection to form a single-layer two-dimensional honeycomb lattice structure. Compared with other carbon materials, graphene has a perfect large π-conjugated system and the thinnest single-layer atomic thickness structure, which enables graphene to exhibit excellent and unique properties in optics, electricity, heat and mechanics, including High electrical conductivity (electron mobility up to 2×105 cm2/(V s)), high strength (Young’s modulus up to 1 TPa), high thermal conductivity (5300W/(m K)), extremely high surface area ( 2630 m2/g), excellent thermal stability, strong hydrophobicity and other characteristics, which make it have a good application prospect in the field of functional coating materials.

Graphene thermal radiation heat dissipation coating

(Summary description)Graphene is a new material in which carbon atoms are tightly packed by sp2 hybrid connection to form a single-layer two-dimensional honeycomb lattice structure. Compared with other carbon materials, graphene has a perfect large π-conjugated system and the thinnest single-layer atomic thickness structure, which enables graphene to exhibit excellent and unique properties in optics, electricity, heat and mechanics, including High electrical conductivity (electron mobility up to 2×105 cm2/(V s)), high strength (Young’s modulus up to 1 TPa), high thermal conductivity (5300W/(m K)), extremely high surface area ( 2630 m2/g), excellent thermal stability, strong hydrophobicity and other characteristics, which make it have a good application prospect in the field of functional coating materials.

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2022-06-13
  • Views:812
Information

Graphene is a new material in which carbon atoms are tightly packed by sp2 hybrid connection to form a single-layer two-dimensional honeycomb lattice structure. Compared with other carbon materials, graphene has a perfect large π-conjugated system and the thinnest single-layer atomic thickness structure, which enables graphene to exhibit excellent and unique properties in optics, electricity, heat and mechanics, including High electrical conductivity (electron mobility up to 2×105 cm2/(V s)), high strength (Young’s modulus up to 1 TPa), high thermal conductivity (5300W/(m K)), extremely high surface area ( 2630 m2/g), excellent thermal stability, strong hydrophobicity and other characteristics, which make it have a good application prospect in the field of functional coating materials.

Common heat transfer methods are: heat conduction, heat convection, and heat radiation.

1. Heat conduction: refers to the heat transfer phenomenon that relies on the thermal motion of microscopic particles such as molecules, atoms and free electrons when parts of objects with different temperatures or two objects with different temperatures are in direct contact.

2. Thermal convection: The phenomenon of transferring heat from one place to another depending on the flow of fluid.

3. Thermal radiation: rely on the surface of the object to emit visible and invisible rays (electromagnetic waves) to transfer heat.

Heat dissipation coating is a kind of special coating that improves the heat dissipation efficiency of the surface of the object and reduces the temperature of the system. Graphene

heat-dissipating coatings can dissipate heat in the form of thermal radiation to reduce the surface temperature of objects. Graphene heat dissipation coating has the characteristics of good self-cleaning, anti-corrosion, waterproof, fire resistance, insulation, acid and alkali resistance, and convenient construction. Therefore, graphene heat dissipation coatings can be widely used in the outer coating of substrate heat dissipation and pipe heat dissipation.

With the development of electronic circuits and communication technology, electronic devices and high-performance chips are constantly developing in the direction of miniaturization, light weight and high efficiency. The size of the device is gradually reduced, and the high temperature generated by the poor heat dissipation not only causes the device to run erratically, shortens its service life, and even burns some components. Therefore, the problem of heat dissipation is a bottleneck restricting the development of lightweight and high-performance devices. The current market mainly uses fin heat dissipation to solve the heat dissipation problem of electronic components, but the fin heat sink is limited by volume and quality, and the heat dissipation efficiency is limited, and it is difficult to meet the heat dissipation requirements of high-power electronic components.

Thermal management is a core component of electronic product components and is receiving increasing attention as assembly densities and integration levels continue to increase. There are many downstream applications of heat dissipation, including consumer electronics, and automobiles, base stations, servers and data centers, and the market space is in the hundreds of billions. According to the forecast of the Prospective Industry Research Institute, the compound annual growth rate of the cooling industry from 2018 to 2023 is 8%, and the market size is expected to increase from 149.7 billion yuan in 2018 to 219.9 billion yuan in 2023.

Mobile phone heat dissipation accounts for about 7% of the total size of the heat dissipation industry, and in 2018, it was about 10 billion yuan. Although the proportion is low, in the future, benefiting from the continuous upgrade of 5G smart terminals, the mobile phone cooling market is expected to maintain high growth, with an average compound growth rate of 26% from 2018 to 2022. In addition, the large-scale construction of 5G commercial base stations is also expected to drive the expansion of the cooling market space for semi-solid die-casting shells and inflation plates. From the perspective of long-term development trends, the increase in network traffic brought by 5G will continue to expand the server cooling market.

In view of the seriousness of the heat dissipation problem, the researchers applied the heat dissipation coating to the electronic field to solve the heat dissipation problem. The general heat dissipation coating is based on polymer as the base material, and then some metal fillers with good thermal conductivity are added, mainly including traditional gold, copper, aluminum, and some non-metallic fillers with high thermal conductivity such as aluminum nitride and silicon nitride. , alumina, magnesium oxide, etc.

The thermal radiation coefficient of metal is generally low, so the effect of thermal radiation on the metal surface in the entire heat exchange process is negligible, but if a layer of graphene thermal radiation coating is sprayed on the metal surface, the thermal radiation effect is qualitative. leap.
In addition to excellent radiation heat dissipation performance, graphene heat dissipation coating also has the characteristics of excellent adhesion, good weather resistance and salt spray resistance, excellent temperature resistance, rich use scenarios, etc., and can be widely used in large Power LED radiator, CPU radiator, industrial equipment cooling, auto parts cooling and other fields.

WJ-5076 is a high temperature resistant heat radiation coating/heat dissipation coating specially developed by Hefei Vigon Material Technology.
It can be used in an environment above 300℃ for a long time without falling off, yellowing, cracking and other phenomena. The graphene added in the coating improves the infrared heat radiation effect of the coating film, and also improves the heat dissipation performance of the parts after painting, and further makes the corrosion resistance, high temperature resistance and other properties of the parts significantly improved.

Advantages of WJ-5076 graphene thermal radiation coating:

Graphene water-based dispersion technology: Disperse high-quality graphene in water-based resin to prepare water-based thermal radiation coatings
High infrared thermal emissivity: infrared thermal emissivity up to 0.95

Excellent heat exchange efficiency: the heat radiation effect is increased by more than 10 times, and the heat transfer efficiency is increased by 70%~80%

Good mechanical properties of the coating: adhesion level 0, resistance to thermal shock at -20℃~150℃

Good temperature resistance: up to 300 ℃, no shedding, no yellowing, no cracking after long-term use

Various construction methods: suitable for spraying process, but also dip coating, scraping coating, brush coating and roller coating

A wealth of optional substrates: common metal, ceramic, and plastic substrates can be constructed

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